HBM Die Carrier
고대역폭 메모리(HBM) Dicing 후 Die Level에서 Test하기 위한 Die Carrier로, 자체 M-POGO Pin을 적용하여 고집적 검사 성능 확보
Package 공정의 Test Handler용 Die Carrier 및 CLT Test용 Die Carrier
Configuration
| Item | Luken | 비 고 |
| Max. pin count | 17k | |
| Stroke | 60㎛ | (Bot:20㎛,Top:40㎛) |
| Contact force | 0.8g±20% | |
| Temp | 120℃ | |
| Max Speed | 20㎓ | |
| Contact resistance | 150mΩ± 50mΩ | |
| CCC | 1.2A/pin | TBD |
| Life time | 5,000回 | TBD |
M-POGO Pin
| Item | Specification |
|---|---|
| Material | Ni Alloy |
| Tip Length | 2,900um ±20um |
| Barrel Thickness | 73um ±2um |
| Contact Stroke | Top : 60um / Bottom : 20um |
| Contact Force | 12.0gf ±10% @80um Stroke |
| Resistance | 120mΩ이내 @80um Stroke |
Insertion Loss
Return Loss
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